Features
   The DLCC family of Ceramic Leadless Chip
   Carrier packages for Diodes is designed for
   all high reliability applications – Space,
   Aerospace, High temperature and Military.

Detailed information
   The DLCC package design takes full advantage of the proven
   high reliability pedigree of the High Temperature Cofired
   Ceramic (HTCC) surface mount packaging technology, which
   is easily integrated for automated assembly. Semelab has
   taken the existing standards for ceramic surface mount
   package manufacture and added additional design features
   to enhance thermal performance, to present a competitive
   alternative for high reliability applications.