Features
The DLCC family of Ceramic Leadless Chip
Carrier packages for Diodes is designed for
all high reliability applications – Space,
Aerospace, High temperature and Military.
Detailed information
The DLCC package design takes full advantage of the proven
high reliability pedigree of the High Temperature Cofired
Ceramic (HTCC) surface mount packaging technology, which
is easily integrated for automated assembly. Semelab has
taken the existing standards for ceramic surface mount
package manufacture and added additional design features
to enhance thermal performance, to present a competitive
alternative for high reliability applications.