Description
In Microsemis Powermite® surface mount package, these zener diodes provide power-handling capabilities found in larger packages. In addition to its size advantages, Powermite® package features include a full metallic bottom that eliminates the possibility of solder flux entrapment during assembly, and a unique locking tab acts as an integral heat sink. Its innovative design makes this device ideal for use with automatic insertion equipment.

FEATUREs
• Surface Mount Packaging
• Integral Heat Sink Locking Tabs
• Compatible with automatic insertion equipment
• Full metallic bottom eliminates flux entrapment
• Zener voltage 1.8 to 100V
• Low noise
• Low reverse leakage current
• Tight tolerance available