Features:
• 64 Position Mezzanine connectors for board stacking.
• 1 mm Centerline high density packaging.
• Mated connector board stacking height of 10 mm.
• Conforms to EIA-700 AAAB for IEEE 1386 applications.
• Suitable for "lead free" reflow soldering (260° C peak).
• Tape & Reel packaged per EIA-783 (56 mm wide;
16 mm pitch).