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AB2S 数据手册 ( 数据表 ) - Chip Integration Technology Corporation

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零件编号
AB2S

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4 Pages

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529.9 kB

生产厂家
CITC
Chip Integration Technology Corporation CITC

■ Features
• Glass passivated die construction.
• Low forward voltage drop.
• High current capability.
• High surge current capability.
• Design for surface mount application.
• Suffix “G” indicates Halogen free parts, ex AB2SG
• Lead free in compliance with EU RoHS.

■ Mechanical data
• Case : SOPA-4,Molded plastic, ABS
• Terminals :plated leads solderable per
                    MIL-STD-202, Method 208
• Polarity : as marked on case
• Mounting position: Any
• Marking: type number


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