ADSD3100 数据手册 ( 数据表 ) - Analog Devices
零件编号
ADSD3100
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2 Pages
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生产厂家
Analog Devices
GENERAL DESCRIPTION
The ADSD3100 is a CMOS 3D Time of Flight (ToF)-based 3D depth and 2D visual light imager that is available for integration into 3D sensor systems. The functional blocks required for read out, which include an analog to digital converter (ADC), pixel biasing circuitry, and sensor control logic, are built into the chip to enable a cost effective and simple implementation into systems.
FEATURES
1024 (horizonal) × 1024 (vertical) pixel array
3.5 μm × 3.5 μm square pixels
1/3.6 inch optical format
4-wire SPI or 2-wire I2C serial interface
MIPI CSI-2 transmitter interface with support for 1, 2, or
4 data lanes, programmable up to 1.5 Gbps per lane
Dual, 3.3 V and 1.27 V external supplies, 1.8 V I/O section
Die size: 5.364 mm × 9.799 mm
APPLICATIONS
Smartphones
Augmented reality (AR)/virtual reality (VR)
Machine vision systems (logistics and inventory)
Robotics (consumer and industrial)
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