These miniature surface mount MOSFETs utilize a high cell density trench process to provide low rDS(on) and to ensure minimal power loss and heat dissipation. Typical applications are DC-DC converters and power management in portable and battery-powered products such as computers, printers, PCMCIA cards, cellular and cordless telephones.
   
• Low rDS(on) provides higher efficiency and
    extends battery life
• Low thermal impedance copper leadframe
    DPAK saves board space
• Fast switching speed
• High performance trench technology