PRODUCT DESCRIPTION
   The AWT6321 addresses the demand for increased integration in dual-band handsets for North American CDMA network deployments. The small footprint 3 mm x 5 mm x 1 mm surface mount RoHS compliant package contains independent RF PA paths to ensure optimal performance in both frequency bands, while achieving a 25% PCB space savings compared with solutions requiring two single-band PAs.

FEATURES
• InGaP HBT Technology
• High Efficiency:
   19 % @ +16 dBm
   39 % @ +28 dBm
• Low Quiescent Current: 15 mA
• Internal Voltage Regulation
• Common VMODE Control Line
• Simplified VCC Bus PCB routing
• Reduced External Component Count
• Low Profile Surface Mount Package: 1 mm
• RoHS Compliant Package, 250 °C MSL-3
• Suitable for BC10 (806-824 MHz) band
   applications

APPLICATIONS
• CDMA/EVDO & Cell & PCS Dual-band Wireless
   Handsets and Data Devices