FEATURES
- Fast switching device(Trr<50nS)
- Surface device type mounting
- Moisture sensitivity level 1
- Low reverse leakage
- Pb free version and RoHS compliant
- Green compound (Halogen free) with suffix "G" on
   packing code and prefix "G" on date code

MECHANICAL DATA
- Case : Bend lead SOD-123 small outline plastic package
- Terminal : Matte tin plated, lead free., solderable
   per MIL-STD-202, Method 208 guaranteed
- Polarity : Indicated by cathode band
- High temperature soldering guaranteed : 260°C/10s
- Weight : 10.5 ± 0.5 mg