FEATURES
● Void Free Vacuum Die Soldering For
Maximum Mechanical Strength and Heat
Dissipation (Solder Voids:
Typical < 2%, Max. < 10% of Die Area)
● Biggest Effective Die Area for the 12 Amp
Class of PR4 Diode Cells
● High Temperature Solder (Solidus 287 °C,
Liquidus 296 °C) to Allow Higher Operating
And Assembly Temperatures
● Copper Headers Are Silver Plated For
Easy Soldering And Superior Solder Joints
● Largest Diameter Header Is Cathode
RoHS COMPLIANT