BYG80D 数据手册 ( 数据表 ) - Philips Electronics
零件编号
BYG80D
Other PDF
no available.
PDF
page
20 Pages
File Size
104.9 kB
生产厂家
Philips Electronics
DESCRIPTION
DO-214AC surface mountable package with glass passivated chip.
The well-defined void-free case is of a transfer-moulded thermo-setting plastic.
FEATURES
• Glass passivated
• High maximum operating temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy absorption capability
• UL 94V-O classified plastic package
• Shipped in 12 mm embossed tape.
零件编号
产品描述 (功能)
PDF
生产厂家
Share Link: