Reverse Voltage: 20 to 200 Volts
Forward Current: 10.0 Amp
RoHS Device

FEATUREs
- Batch process design, excellent power dissipation offers
   better reverse leakage current and thermal resistance.
- Low profile surface mounted application in order to
   optimize board space.
- Low power loss, high efficiency.
- High current capability, low forward voltage drop.
- High surge capability.
- Guarding for overvoltage protection.
- Ultra high-speed switching.
- Silicon epitaxial planar chip, metal silicon junction.
- Lead-free part meets environmental standards of
   MIL-STD-19500 /228

Mechanical data
- Case: TO-263/D2PAK, molded plastic.
- Terminals: solderable per MIL-STD-750,
                    method 2026.
- Polarity: Indicated by cathode band.
- Weunting Position: Any
- Weight:1.70 gram(approx.).