Product Description
   The CM6126 is an Application Specific Integrated Passive (ASIP) component in a 2 x 2, 4−bump, 0.5 mm pitch, CSP form factor. This device is designed for:

• Transient Voltage Suppression
• Electrostatic Discharge Protection
• Electrical Overstress Protection

FEATUREs
• 4−Bump, 0.96 mm X 0.96 mm Footprint Chip Scale Package (CSP)
• These Devices are Pb−Free and are RoHS Compliant