CPD104R 数据手册 ( 数据表 ) - Central Semiconductor
零件编号
CPD104R
Other PDF
no available.
PDF
page
2 Pages
File Size
709.5 kB
生产厂家
Central Semiconductor
PROCESS DETAILS
Die Size 14.6 x 14.6 MILS
Die Thickness 3.9 MILS
Anode Bonding Pad Area 11.8 x 11.8 MILS
Top Side Metalization Al - 30,000Å
Back Side Metalization Au - 12,000Å
零件编号
产品描述 (功能)
PDF
生产厂家
Schottky Diode High Current, Low VF Schottky Diode Chip ( Rev : 2006 )
Central Semiconductor
Share Link: