Features
• Batch process design, excellent power dissipation offers
   better reverse leakage current and thermal resistance.
• Low power loss, high efficiency.
• High current capability, low forward voltage drop.
• High surge capability.
• Guardring for overvoltage protection.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
• Lead-free parts meet environmental standards of
   MIL-STD-19500 /228
• Suffix "-H" indicates Halogen-free part, ex.ECC1020Y-D-H.

Mechanical Data
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, TO-252 / DPAK
• Terminals : Solder plated, solderable per
   MIL-STD-750, Method 2026
• Mounting Position : Any
• Weight : Approximated 0.34 gram