INTRODUCTION
Fast and easy breadboarding of circuits using the PA241DF IS possible with the EK13 evaluation kit. The amplifier may be surface mounted directly to the PC board. The PA241DF is soldered to a 2-square inch area of foil on the PC board for heat sinking. This foil heat sink is connected to–Vs. Connections are provided for required power supply bypassing, phase compensation components, and a current limit resistor. A large area for component mounting provides flexibility and makes a multitude of circuit configurations possible.