ESJC30-08 is high reliability resin molded type high voltage diode in small size package which is sealed a multilayed mesa type silicon chip by epoxy resin.

FEATUREs
• High speed switching
• Low VF
• High surge resisitivity for CRT discharge
• High reliability design
• Ultra small pakage

APPLICATIONs
• X light Power supply
• Laser
• Voltage doubler circuit
• Microwave emission power