Features
• HiPerFET™ technology
   - low RDSon
   - low gate charge for high frequency operation
   - unclamped inductive switching (UIS) capability
   - dv/dt ruggedness
   - fast intrinsic reverse diode
• ISOPLUS i4-PACTM package
   - isolated back surface
   - low coupling capacity between pins and heatsink
   - enlarged creepage towards heatsink
   - application friendly pinout
   - low inductive current path
   - high reliability
   - industry standard outline
   - UL registered E 72873

APPLICATIONs
• drives and power supplies
• battery or fuel cell powered
• automotive, industrial vehicle etc.
• secondary side of mains power supplies