[Microsemi Shanghai]

FEATUREs
• Glass passivated die construction
• Integrally molded heatsink provides Very low thermal resistance for Maximum heat dissipation
• The plastic material used carries UL flammability recognition 94V-0
• High surge current capability
• High temperature soldering guaranteed: 260℃ /10 seconds, 0.375” (9.5mm) lead length, 5lbs. (2.3kg) tension