INTRODUCTION
Oki’s 10-GHz logic devices are manufactured using a 0.2-µm, ion-implanted process, which is similar to Oki’s familiar 0.5-µm telecommunications process. However, the 0.2-µm process uses a phase-shifting edge line (PEL) masking method for gate fabrication. Gold-based, three-level metal interconnections are used for high density and shorter wiring paths. Layers 1 and 2 are signal lines. Layer 3, which is formed by electroplating, is used for ground or power supply lines because of its lower resistance. An optional buried “p” channel structure is adopted for reducing short channel effects.

FEATURES
• 10-Gbps operation: highest speed available
• ECL level logic swings: easy interface to other  logic
• Inputs internally terminated: reduces noise and  phase jitter
• 50-Ω I/Os: easy to interconnect hardware