Features
■ Lead free product
■ Leadless chip form, no lead Damage
■ Lead free Solder joint external
■ Low profile package
■ For surface mounted application
■ Built-in strain relief
■ Low power loss, high efficiency
■ High current capability
■ High surge capacity

Mechanical Data
■ Case Packed with EPOXY
■ Mounting: Position Any
■ Terminals: Pure Tin Plated
   Solderable per MIL-STD-202E,
   Method 208C
■ Plastic package has Underwriters Lab.
■ Flammability Classification 94V-0
■ Polarity: Laser Marking A,B,G,J,K,M
■ Weight: 0.064g