FEATURES
● FOR SURFACE MOUNTED APPLICATIONS
● LOW PROFILE PACKAGE
● BUILT-IN STRAIN RELIEF
● EASY PICK AND PLACE
● PLASTIC MATERIAL USED CARRIES UNDERWRITERS LABORATORY CLASSIFICATION 94 V-0
● ULTRA FAST SWITCHING
● GLASS PASSIVATED CHIP JUNCTION
● HIGH TEMPERATURE SOLDERING: 250°C/10 SECONDS AT TERMINALS