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HM66(V2) 数据手册 ( 数据表 ) - BI Technologies

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零件编号
HM66

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8 Pages

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75.6 kB

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BI-Technologies
BI Technologies BI-Technologies

FEATURES AND BENEFITS
• Very low profile, 1.8 mm to 4.0 mm
• Magnetic shielded construction for high density board assembly
• 1 µH to 330 µH inductance range
• Up to 10 amps continuous
• Designed for machine placement
• Compatible with vapor phase and infrared reflow soldering


APPLICATIONS
• Wireless and PDAs
• PCMCIA cards and disk drives
• Inductor for space limited design

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零件编号
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