Description
These solid state surface mount indicators are designed with a flat top and sides to be easily handled by automatic placement equipment. A glue pad is provided for adhesive mounting processes. They are compatible with convective IR and vapor phase reflow soldering and conductive epoxy attachment processes.

FEATUREs
• Compatible with Automatic Placement Equipment
• Compatible with Infrared and Vapor Phase Reflow Solder Processes
• Packaged in 12 mm or 8 mm tape on 7" or 13" Diameter Reels
• EIA Standard Package
• Low Package Profile
• Nondiffused Package Excellent for Backlighting and Coupling to Light Pipes