FEATURES
● VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH
AND HEAT DISSIPATION
(Solder Voids: Typical < 2%, Max. < 10% of Die Area)
● BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE
● SURGE OVERLOAD RATING TO 200 AMPS PEAK
● IDEAL FOR PRINTED CIRCUIT BOARD APPLICATIONS
● UL RECOGNIZED - FILE #E141956
● RoHS COMPLIANT