Features
1. Opaque type, mini-flat package.
2. Subminiature type
   (The volume is smaller than that of our conventional DIP type by as far as 30%).
3. Current transfer ratio (CTR:MIN.50% at IF=5mA, Vce=5V)
4. Isolation voltage between input and output (Viso:3750Vrms).

APPLICATIONs
1. Hybrid substrates that reguire high density mounting.
2. Programmable controllers.