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LX5553 数据手册 ( 数据表 ) - Microsemi Corporation

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零件编号
LX5553

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Microsemi
Microsemi Corporation Microsemi

DESCRIPTION
LX5553 is a high-integration, highperformance WLAN front-end module (FEM) for 802.11b/g/n and other applications in the 2.4-2.5GHz frequency range. LX5553 integrates an advanced InGaP/GaAs Hetero-junction Bipolar Transistor (HBT) power amplifier with on chip impedance matching, a fully matched low noise amplifier based on InGaAs Enhancement mode pseudo-morphic high electron mobility transistor (E-pHEMT) technology, and a Depletion mode pHEMT (D-pHEMT) singlepole triple-throw (SP3T) switch, all into a single package with 3x3mm footprint. LX5553 provides capability of sharing a single antenna between WLAN and Bluetooth systems through the SP3T switch.


KEY FEATURES
◾ 2.4-2.5GHz 802.11b/g/n FrontEnd Solution in a Single MLP Package
◾ SP3T for Sharing Antenna between WLAN and Bluetooth systems
◾ All RF I/O Matched to 50 
◾ Single-Supply Voltage 3.0V to 4.2V
◾ Small Footprint: 3x3mm2
◾ Low Profile: 0.55mm
◾ RoHS Compliant & Pb-Free

TX Features :
◾ Power Gain ~ 25 dB*
◾ Pout ~ +17 dBm* for 3% EVM at Antenna
◾ Current ~145 mA at +17 dBm*
◾ Pout ~ +21 dBm* for 11b 1Mbps DSSS Mask Compliance
◾ Quiescent Current ~ 82 mA

RX Features :
◾ Gain ~ 13 dB*
◾ Noise Figure ~ 2.1 dB*
◾ IIP3 ~ +5 dBm*

Bluetooth Path :
◾ Insertion Loss ~ 0.9 dB
◾ IP1dB ~ +29 dBm
* Including SP3T switch loss


APPLICATIONS
◾ IEEE 802.11b/g/n
◾ Mobile Phone WLAN module

Page Link's: 1  2  3 

零件编号
产品描述 (功能)
PDF
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