Description
M/A-COM’s MA4FCP Series consists of Silicon Flip Chip PIN diodes fabricated with M/A-COM’s patented HMIC process. This diode is fabricated on epitaxial wafers using a process designed for repeatable electrical characteristics and extremely low parasitics. This diode is fully passivated with Silicon Nitride and has an additional layer of Polyimide for scratch protection. These protective coatings prevent damage to the junction during automated or manual handling. This flip chip configuration is suitable for pick and place insertion.

FEATUREs
• Lower Series Resistance : 2.6 Ω
• Lower Capacitance : 40 fF
• Faster Switching Speed : 40 nS
• Silicon Nitride Reliability Passivation
• Polyimide Scratch Protection
• Designed for Automated Pick and Place Insertion
• Rugged by Design