FEATURES
• With TO-251(DPKE) package
• Schottky Barrier Chip
• Guard Ring Die Construction for Transient Protection
• Low Power Loss,High Efficiency
• High Surge Capability
• High Current Capability and Low Forward Voltage Drop
• Minimum Lot-to-Lot variations for robust device
   performance and reliable operation

APPLICATIONS
• High frequency switching
• High efficiency SMPS
• Automotive