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MBRF10100D 数据手册 ( 数据表 ) - TSC Corporation

MBRF10100D image

零件编号
MBRF10100D

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page
2 Pages

File Size
156.7 kB

生产厂家
TSC
TSC Corporation TSC

Features
Metal silicon junction, majority carrier conduction
Low power loss, high efficiency
High current capability, low forward voltage drop
High Surge capability
Guarding for overvoltage protection
High temperature soldering guaranteed: 260℃/0 seconds, 0.25"(6.35mm) from case
Plastic material used carries Underwriters Laboratory
  Classifications 94V-0
For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications
Green compound with suffix "G" on packing code & prefix "G" on datecode

Page Link's: 1  2 

零件编号
产品描述 (功能)
PDF
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