Features
◇ Epitaxial planar die construction
◇ Surface device type mounting
◇ Moisture sensitivity level 1
◇ Driver Transistor
◇ Pb free version and RoHS compliant
◇ Green compound (Halogen free) with suffix "G" on packing code and prefix "G" on date code

Mechanical Data
◇ Case:SOT-23 small outline plastic package per MIL-STD-202, Method 208 guaranteed
◇ High temperature soldering guaranteed:260℃ /10s
◇ Weight: 7.888mg