Features
1) Area ratio is approximately 55% smaller than that of the MCH18, enabling high - density mounting.
2) Mounting costs are reduced.
3) Use of convex electrodes prevents solder bridging during mounting, and makes it easy to perform a visual inspection of the mounted piece. Also facilitates automatic inspection.
4) Barrier layer and end terminations to improve solderability.
5) Each element is independent to ensure a wide range of circuit applications.
6) Can be packed on tape.