Features
◇ For surface mounted application
◇ Easy pick and place
◇ Glass passivated junction chip
◇ Low profile package
◇ Built-in strain relief
◇ Hideal for automated placement
◇ Ultrafast recovery time for high efficiency
◇ Low forward voltage, low power loss
◇ High temperature soldering guarateed: 260℃ /10 seconds on terminals
◇ Meet MSL level 1, per J-STD-020D, lead free maximum peak of 260℃
◇ Plastic material used carriers Underwritters Laboratory Classcification 94V-0
◇ Epitaxial construction
◇ Green compound with suffix "G" on packing code & prefix "G" on datecode