DESCRIPTION
The NTE series of miniature surface mounted DC/DC Converters employ leadframe technology and transfer moulding techniques to bring all of the benefits of IC style packaging to hybrid circuitry. The devices are fully compatible with CECC00802 to 280°C which allows them to be placed and reflowed with IC’s, thus reducing time and cost in production. The co-planarity of the pin positions is based upon IEC 191-6:1990. The devices are suitable for all applications where high volume production is envisaged.

FEATURES
■ Wide Temperature Performance at Full 1 Watt Load, –40°C to 85°C
■ Lead Frame Technology
■ Maximum Reflow Temperature 280°C
■ Single Isolated Output
■ 1kVDC Isolation
■ Efficiency to 78%
■ Power Density 1.8W/cm³
■ 3.3V, 5V & 12V Input
■ 3.3V, 5V, 9V, 12V and 15V Output
■ Footprint Over Pins 1.64cm²
■ UL 94V-0 Package Material
■ No Heatsink Required
■ Internal SMD Construction
■ Toroidal Magnetics
■ Plastic Encapsulated
■ MTTF up to 2.9 Million Hours
■ Custom Solutions Available
■ Multi Layer Ceramic Capacitors
■ Lead Free Compatible