Features
• Planar Technology Device Offers Low RDS(on) and Fast Switching Speed
   in a ChipFET Package
• Leadless ChipFET Package has 40% Smaller Footprint than TSOP−6.
   Ideal Device for Applications Where Board Space is at a Premium.
• ChipFET Package Exhibits Excellent Thermal Capabilities Where
   Heat Transfer is Required.
• Pb−Free Package is Available

APPLICATIONs
• Buck and Boost Converters
• Optimized for Battery and Load Management Applications in
   Portable Equipment such as Notebook Computers, MP3 Players,
   Cell Phones, Digital Cameras, Personal Digital Assistants and Other
   Portable Applications
• Charge Control in Battery Chargers