Technology Overview
Luminus Big Chip LEDs™ benefit from a suite of innovations in the fields of chip technology, packaging and thermal management. These breakthroughs allow illumination engineers and system designers to achieve solutions that are high brightness and high efficiency.

FEATUREs:
• Matched RGB Chipset with 3.9 mm2 emitting area designed for LED projector applications
• Enhanced thermal performance allows for operation up to 12 A (3A/mm2)
• Ultra low thermal resistance, common anode copper-core PCB package
• Photonic lattice technology for very high surface brightness and uniform surface emission
• Wide color gamut: Red-Amber 613nm, GREEN 525 nm, Blue 460nm typical dominant wavelength
• Single emitting area per color allows for collection with single lens for simplified optics
• LED mounted on MC-PCB for easier thermal and optical integration
• Aspect ratio optimized and compatible with micro-display diagonal sizes ranging from 0.45” to 0.55”
• RoHS (EU-2002/95/EC Directive) and REACH compliant

APPLICATIONs
• Specifically engineered for high brightness pocket-size, ultra portable front projectors, head-up projection displays and hybrid projectors
• Optimized for Micro-Display diagonal sizes ranging from 0.45” to 0.55”
• Suitable for DLP™ ( 0.45” WXGA, 0.55” SVGA), LCoS and HTPS /3LCD microdisplays