Overview
This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged
in a 48-pin plastic molded LQFP. ThisMCU operates using sophisticated instructions featuring a high level of
instruction efficiency. With 1 Mbyte ofaddress space, it is capable of executing instructions athigh speed. This
Furthermore, the data flash (1 KB x2 blocks) is embedded in the R8C/21 Group.

APPLICATIONs
Automotive, etc.