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RMPA2266 数据手册 ( 数据表 ) - Fairchild Semiconductor

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零件编号
RMPA2266

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7 Pages

File Size
180 kB

生产厂家
Fairchild
Fairchild Semiconductor Fairchild

General Description
The RMPA2266 Power Amplifier Module (PAM) is Fairchild’s latest innovation in 50Ω matched, surface mount modules targeting UMTS/WCDMA/HSDPA applications. Answering the call for ultra-low DC power consumption and extended battery life in portable electronics, the RMPA2266 uses novel proprietary circuitry to dramatically reduce amplifier current at low to medium RF output power levels (< +16dBm), where the handset most often operates. A simple two-state Vmode control is all that is needed to reduce operating current by more than 60% at 16dBm output power, and quiescent current (Iccq) by as much as 70% compared to traditional power-saving methods. No additional circuitry, such as DC-to-DC converters, are required to achieve this remarkable improvement in amplifier
efficiency.


FEATUREs
■ 40% WCDMA efficiency at +28dBm Pout
■ 20% WCDMA efficiency (58mA total current) at +16dBm Pout
■ Low quiescent current (Iccq): 25mA in low-power mode
■ Meets UMTS/WCDMA performance requirements
■ Meets HSDPA performance requirements
■ Single positive-supply operation with low power and shutdown modes
    – 3.4V typical Vcc operation
    – Low Vref (2.85V) compatible with advanced handset chipsets
■ Compact Lead-free compliant LCC package – (4.0 x 4.0 x 1.0mm nominal)
■ Industry standard pinout
■ Internally matched to 50Ω and DC blocked RF input/output

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