S1ABF-PJ 数据手册 ( 数据表 ) - ETC
零件编号
S1ABF-PJ
产品描述 (功能)
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3 Pages
File Size
474.7 kB
生产厂家
ETC
[Dongguan Pingjingsemi Technology Co., Ltd.]
FEATURES
◆ For surface mount applications
◆ Glass passivated chip junction
◆ Low profile package
◆ Easy to pick and place
◆ Lead free in comply with EU RoHS2011/65/EU directives
MECHANICAL DATA
◆ Case: SMBF molded plastic body
◆ Terminals: Solderable per MIL-STD-750， Method 2026
◆ Weight: Approximated 0.057 grams
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