S1DF 数据手册 ( 数据表 ) - Gaomi Xinghe Electronics Co., Ltd.
零件编号
S1DF
Other PDF
no available.
PDF
page
2 Pages
File Size
251.3 kB
生产厂家
Gaomi Xinghe Electronics Co., Ltd.
FEATURES
• For surface mounted applications
• Low profile package
• Glass Passivated Chip Juntion
• Easy to pick and place
• Lead free in comply with EU RoHS 2011/65/EU directives
MECHANICAL DATA
• Case: SMAF
• Terminals: Solderable per MIL-STD-750, Method 2026
• Approx. Weight: 27mg 0.00086oz
零件编号
产品描述 (功能)
PDF
生产厂家
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