FEATURES
● Low profile package
● For surface mounted applications
● High current capability
● Built-in strain relief, ideal for automated placement
● Plastic package has Underwriters Laboratory
   Flammability Classification 94V-0
● High temperature soldering: 250℃/10 seconds at terminals

MECHANICAL DATA
● Case: JEDEC SMBT,molded plastic over passivated chip
● Terminals: Solder Plated, solderable per MIL-STD- 750, Method 2026
● Polarity: Color band denotes cathode end