Features:
• Schottky Barrier Chip
• Ideally Suited for Automatic Assembly
• Low Power Loss, High Efficiency
• For Use in Low Voltage Applications
• Guard ring Die Construction
• Plastic Case Material has UL Flammability
   Classification Rating 94V-O
• This is a Pb - Free Device
• All SMC parts are traceable to the wafer lot
• Additional testing can be offered upon request

MECHANICAL DATA
• Case: Low Profile Molded Plastic
• Terminals: Solder Plated, Solderable 
   per MIL-STD-750, Method 2026
• Polarity: Cathode Band or Cathode Notch
• Marking: Type Number
• Weight: 0.064 grams (approx.)