Features
• Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance.
• Low profile surface mounted application in order to optimize board space.
• Tiny plastic SMD package.
• Low power loss, high efficiency.
• High current capability, low forward voltage drop.
• High surge capability.
• Guardring for overvoltage protection.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
• Moisture Sensitivity Level 1