FEATURES
* For surface mounted applications in order to optimize board space
* Low profile package
* Built-in strain relief
* Glass passivated junction
* Low inductance
* Excellent clamping capability
* Repetition Rate(duty cycle):0.01%
* Fast response time: typically less than 1.0ps from 0 Volts to BV for unidirectional types
* Typical IR less than 1mA above 10V
* High temperature soldering: 250°C/10 seconds at terminals
* Plastic package has Underwriters Laboratory Flammability 94V-O
* RoHS product for packing code suffix "G" Halogen free product for packing code suffix "H"*