FEATURES
◇ For surface mounted applications in order to optimize board space.
◇ Low profile package.
◇ Built-in strain relief.
◇ Glass passivated junction.
◇ Low inductance.
◇ Excellent clamping capability.
◇ Repetition Rate (duty cycle): 0.05%.
◇ Fast response time: typically less than 1.0ps from 0 volt to BV min.
◇ Typical IR less than 1μA above 10V.
◇ High Temperature soldering: 260°C/10 seconds at terminals.
◇ Plastic package has Underwriters Laboratory Flammability 94V-O.