FEATURES
• RoHS compliant
• For surface mounted applications in order to optimize board space
• Low profile package
• Built-in strain relief
• Typical maximum temperature coefficient ΔVBR = 0.1% × VBR@25℃ × ΔT
• Glass passivated chip junction
• 3000W peak pulse power capability at lOxlOOOUs waveform, repetition rate {duty cycles):0.01 %
• Fast response time:typically less than l.Ops from OV to BV min
• Excellent clamping capability
• Low incremental surge resistance
• Typical IR less than 2UA above 12V
• High Temperature soldering guaranteed: 260℃/40 seconds at terminals
• Plastic package has Underwriters Laboratory Flammability 94V-O
• Matte Tin Lead-free Plated