Features
• Plastic package has Underwriters Laboratories
   Flammability Classification 94V-0
• Metal silicon junction, majority carrier conduction
• For surface mount applications
• Low power loss, high efficiency
• High current capability, Low forward voltage drop.
• Low profile package
• Built-in strain relief, ideal for automated placement
• For use in low voltage, high frequency inverters,
   free wheeling, and polarity protection applications
• High temperature soldering guaranteed:
   250/10sec at terminals

Mechanical Data
• Case: JEDEC DO-214AA, molded plastic body
• Terminals: Solder plated, solderable per
   MIL-STD-750, Method 2026
• Polarity: Color band denotes cathode end