FEATURES
• Low profile package
• Ideal for automated placement
• Guardring for overvoltage protection
• Low power losses, high efficiency
• Very low forward voltage drop
• High surge capability
• Meets MSL level 1, per J-STD-020, LF maximum
   peak of 260 °C
• Solder dip 260 °C, 40 s
• Component in accordance to RoHS 2002/95/EC
   and WEEE 2002/96/EC

MECHANICAL DATA
   Case: DO-214AA (SMB)
   Epoxy meets UL 94V-0 flammability rating
   Terminals: Matte tin plated leads, solderable per
   J-STD-002 and JESD22-B102
   E3 suffix for consumer grade, meets JESD 201 class
   1A whisker test, HE3 suffix for high reliability grade
   (AEC Q101 qualified), meets JESD 201 class 2 whisker test
   Polarity: Color band denotes the cathode end