Product Description
The TGA2925-SG HPA provides 11 •B of gain, 5.6 W of output power at 3.5 GHz and 2.5% EVM at 29 dBm output power. The device is ideally suited for high linearity, high power wireless data applications such as 802.16 and WiMax. The package has a high thermal conductivity copper alloy base. Internal partial matching simplifies system board layout by requiring a minimum of external components.
KEY FEATUREs
• 3.5 GHz Application Frequency Range
• 11 dB Nominal Gain
• 2.5%EVM @29dBm OFDM signal at 3.5GHz
• 37.5 dBm Nominal Psat
• Internally Partially Matched
• IMD3 -50 dBc @ 24 dBm SCL, Typical
• Bias Conditions: 8 V @ 0.75 A (Quiescent)
• 0.5 µm HFET Technology
• 2 lead Cu-alloy base package
Primary Applications
• 802.16 and WiMax
• S-Band Power Amplifiers