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TPSMC12(1999) 数据手册 ( 数据表 ) - General Semiconductor

TPSMC6.8 image

零件编号
TPSMC12

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4 Pages

File Size
59.3 kB

生产厂家
GE
General Semiconductor GE

FEATURES
♦ Designed for under the hood surface mount applications
♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0
♦ Easy pick and place
♦ Low profile package
♦ Built-in strain relief
♦ Ideal for automated placement
♦ Exclusive patented PAR™ oxide passivated chip construction
♦ 1500W peak pulse power capability with a 10/1000µs waveform, repetition rate (duty cycle): 0.01%
♦ Excellent clamping capability
♦ Low incremental surge resistance
♦ Fast response time: typically less than 1.0ps from 0 Volts to V(BR)
♦ For devices with V(BR)≥10V ID are typically less than 1.0µA at TA=150°C
♦ High temperature soldering: 250°C/10 seconds at terminals

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零件编号
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